FINAL CALL FOR PAPERS\nISQED 2008\nInternational Symposium and Exhibits in Quality Electronic Design\nLeading Design for Quality & Manufacturability\n[URL="http://www.isqed.org"]www.isqed.org[/URL]\n\n\nPaper Submission Deadline: October 29, 2007\nAcceptance Notifications: November 23, 2007\nFinal Camera-Ready paper: January 3, 2008\n\n\nThe International Symposium on Quality Electronic Design (ISQED) is a\npremier Design & Design Automation conference, aimed at bridging the gap\nbetween and integration of, electronic design tools and processes,\nintegrated circuit technologies, processes & manufacturing, to achieve\ndesign quality. ISQED is the pioneer and leading international conference\ndealing with the design for manufacturability and quality issues\nfront-to-back. ISQED spans three days, Monday through Wednesday, in three\nparallel tracks, hosting near 100 technical presentations, several keynote\nspeakers panel discussions, workshops /tutorials and other informal\nmeetings. Conference proceedings are published by IEEE and hosted in the\ndigital library. Proceedings CD ROMs are published by ACM. In addition,\ncontinuing the tradition of reaching a wider readership in the IC design\ncommunity, ISQED will continue to publish special issues in leading\njournals. The authors of high quality papers will be invited to submit an\nextended version of their papers for the special journal issues.\n\nPapers are requested in the following areas:\n\nA pioneer and leading multidisciplinary conference, ISQED accepts and\npromotes papers related to the manufacturing, VLSI design and EDA. Authors\nare invited to submit papers in the various disciplines of high level\ndesign, circuit design, test & verification, design automation tools;\nprocesses; flows, device modeling, semiconductor technology, and advance\npackaging.\n\n1. Manufacturing, Semiconductor Process and Devices\n 1.1 Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ)\n 1.2 Effects of Technology on IC Design, Performance, Reliability,\nand Yield (TRD)\n\n2. Design\n 2.1 System-level Design, Methodologies & Tools (SDM)\n 2.2 Package - Design Interactions & Co-Design (PDI)\n 2.3 Robust & Power-conscious Devices, Interconnects, and Circuits\n(PCC)\n 2.4 Emerging/Innovative Process & Device Technologies and Design\nIssues (EDT)\n 2.5 Design of Reliable Circuits and Systems (DFR)\n3. EDA/CAD\n 3.1 EDA Methodologies, Tools, Flows & IP Cores; Interoperability\nand Reuse (EDA)\n 3.2 Design Verification and Design for Testability (DVFT)\n 3.3 Physical Design, Methodologies & Tools (PDM)\n\nThe details of various topics of paper submission is as follows:\n\nSubmission of Papers\nPaper submission must be done on-line via the conference web site at\n[URL="http://www.isqed.org"]www.isqed.org[/URL]. Authors should submit FULL-LENGTH, original, unpublished\npapers (Minimum 4, maximum 6 pages) along with an abstract of about 200\nwords. Please check the as-printed appearance of your paper before\nuploading. To permit a blind review, do not include name(s) or\naffiliation(s) of the author(s) on the manuscript and abstract. The\ncomplete contact author information needs to be entered separately.\nThe guidelines for the final paper format are provided on the conference web\nsite at [URL="http://www.isqed.org"]www.isqed.org[/URL]. Authors of the submitted papers must register and\nattend the conference for their paper to be published.