Final call for papers - ISQED08

Discussion in 'Computer Information' started by SVTI, Oct 28, 2007.

  1. SVTI

    SVTI Guest

    ISQED 2008
    International Symposium and Exhibits in Quality Electronic Design
    Leading Design for Quality & Manufacturability

    Paper Submission Deadline: October 29, 2007
    Acceptance Notifications: November 23, 2007
    Final Camera-Ready paper: January 3, 2008

    The International Symposium on Quality Electronic Design (ISQED) is a
    premier Design & Design Automation conference, aimed at bridging the gap
    between and integration of, electronic design tools and processes,
    integrated circuit technologies, processes & manufacturing, to achieve
    design quality. ISQED is the pioneer and leading international conference
    dealing with the design for manufacturability and quality issues
    front-to-back. ISQED spans three days, Monday through Wednesday, in three
    parallel tracks, hosting near 100 technical presentations, several keynote
    speakers panel discussions, workshops /tutorials and other informal
    meetings. Conference proceedings are published by IEEE and hosted in the
    digital library. Proceedings CD ROMs are published by ACM. In addition,
    continuing the tradition of reaching a wider readership in the IC design
    community, ISQED will continue to publish special issues in leading
    journals. The authors of high quality papers will be invited to submit an
    extended version of their papers for the special journal issues.

    Papers are requested in the following areas:

    A pioneer and leading multidisciplinary conference, ISQED accepts and
    promotes papers related to the manufacturing, VLSI design and EDA. Authors
    are invited to submit papers in the various disciplines of high level
    design, circuit design, test & verification, design automation tools;
    processes; flows, device modeling, semiconductor technology, and advance

    1. Manufacturing, Semiconductor Process and Devices
    1.1 Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ)
    1.2 Effects of Technology on IC Design, Performance, Reliability,
    and Yield (TRD)

    2. Design
    2.1 System-level Design, Methodologies & Tools (SDM)
    2.2 Package - Design Interactions & Co-Design (PDI)
    2.3 Robust & Power-conscious Devices, Interconnects, and Circuits
    2.4 Emerging/Innovative Process & Device Technologies and Design
    Issues (EDT)
    2.5 Design of Reliable Circuits and Systems (DFR)
    3. EDA/CAD
    3.1 EDA Methodologies, Tools, Flows & IP Cores; Interoperability
    and Reuse (EDA)
    3.2 Design Verification and Design for Testability (DVFT)
    3.3 Physical Design, Methodologies & Tools (PDM)

    The details of various topics of paper submission is as follows:

    Submission of Papers
    Paper submission must be done on-line via the conference web site at Authors should submit FULL-LENGTH, original, unpublished
    papers (Minimum 4, maximum 6 pages) along with an abstract of about 200
    words. Please check the as-printed appearance of your paper before
    uploading. To permit a blind review, do not include name(s) or
    affiliation(s) of the author(s) on the manuscript and abstract. The
    complete contact author information needs to be entered separately.
    The guidelines for the final paper format are provided on the conference web
    site at Authors of the submitted papers must register and
    attend the conference for their paper to be published.
    SVTI, Oct 28, 2007
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