Discussion in 'Computer Information' started by info, Aug 15, 2004.

  1. info

    info Guest

    Call for Papers

    ISQED 2005
    6th IEEE International Symposium on


    March 28-30, 2005
    San Jose, CA, USA


    ISQED is the pioneer and leading international conference dealing with the
    design for manufacturability and quality issues front-to-back.
    ISQED spans three days, Monday through Wednesday, in three parallel tracks,
    hosting near 100 technical
    presentations, six keynote speakers, two-three panel discussions, workshops
    /tutorials and other informal meetings.
    Conference proceedings are published by IEEE Computer Society and hosted in
    the digital library. Proceedings CD ROMs
    are published by ACM. In addition, continuing the tradition of reaching a
    wider readership in the IC design community,
    ISQED will continue to publish special issues in leading journals. The
    authors of high quality papers will be invited
    to submit an extended version of their papers for the special journal


    Paper Submission Deadline September 30, 2004
    Acceptance Notification November 17-19, 2004
    Final Camera-Ready Paper December 15, 2004

    Papers are requested in the following areas:

    o Design for Manufacturability & Quality
    o Package - Design Interaction & Co-Design
    o Design Verification and Design for Testability
    o Embedded Test Methodologies
    o Robust Device, Interconnect, and Circuits
    o EDA Tools & IP Blocks; Interoperability and Implications
    o Physical Design, Methodologies & Tools
    o Effect of Technology on IC Design, Performance, Reliability & Yield
    o Design Quality Definitions, Metrics, and Standards
    o Quality Driven Design Flows; SoC, ASIC, FPGA, RF, Memory, etc.
    o Quality of Modeling Abstractions and Methods (Device, Interconnect,
    Micro and Macro Cells, IP Blocks, ...)
    O System-level Design, Methodologies & Tools
    o Redundancy & Self Correction Design Techniques
    o Management of Design Process, and Design Database
    o Global, Social, and Economic Implications of Design Quality
    o Quality based EDA Tools, Design Techniques, and Methodologies, dealing
    with issues such as:

    Timing Closure
    R, L, C Extraction
    Ground/Vdd Bounce
    Signal Noise/Cross-Talk /Substrate Noise
    Voltage Drop, Power Rail Integrity
    Metal Migration, Hot Carriers
    High Frequency Effects
    Thermal Effects
    Power Estimation
    Plasma Induced Damage, and other yield limiting effects
    Proximity Correction & Phase Shift Methods
    erification (Layout, Circuit, Function, etc.)
    Packaging Modeling and Simulations

    Submission Process

    The guidelines for the final paper format is provided on the conference web
    site at
    Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4,
    maximum 6 pages).
    To permit a blind review, do not include name(s) or affiliation(s) of the
    author(s) on the manuscript and abstract.
    Submit your papers using the on-line paper submission procedure available in
    the ISQED web site. Please check the as-printed
    appearance of your paper before submitting the paper. Address all other
    inquiries to .
    info, Aug 15, 2004
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