Call for Papers, IEEE ISQED 2006

Discussion in 'Computer Information' started by ISQED, Aug 29, 2005.

  1. ISQED

    ISQED Guest


    ISQED 2006, 7th International Symposium on


    March 27-29, 2006. San Jose, CA, USA

    ISQED is the pioneer and leading international conference dealing with the
    design for manufacturability and quality issues front-to-back. ISQED spans
    three days, Monday through Wednesday, in three parallel tracks, hosting near
    100 technical presentations, six keynote speakers, two-three panel
    discussions, workshops /tutorials and other informal meetings. Conference
    proceedings are published by IEEE Computer Society and hosted in the digital
    library. Proceedings CD ROMs are published by ACM. In addition, continuing
    the tradition of reaching a wider readership in the IC design community,
    ISQED will continue to publish special issues in leading journals. The
    authors of high quality papers will be invited to submit an extended version
    of their papers for the special journal issues.

    Papers are requested in the following areas
    A pioneer and leading multidisciplinary conference, ISQED accepts and
    promotes papers related to the design and manufacturing of quality-based
    integrated circuits and systems, from design concept to production and all
    key steps between. Authors are invited to submit papers in the various
    disciplines of high level design, circuit design, test & verification,
    design automation tools; processes; and flows, device modeling,
    semiconductor technology, and advance packaging. Authors are further
    encouraged to highlight the link between their subject of interest to the
    overall design flow chain and address the design quality aspects of the
    subject (e.g.,. performance, power, yield, reliability, manufacturability,
    time to market , and environmental considerations, etc.).

    Design for Manufacturability & Quality (DFMQ)
    Analysis, modeling, and abstraction of manufacturing process parameters and
    effects for highly predictable silicon performance. Design and synthesis of
    high complexity ICs: signal integrity, transmission line effects, OPC,
    phase shifting, and sub-wavelength lithography, manufacturing yield and
    technology capability. Design for diagnosability, defect detection and
    tolerance; self-diagnosis, calibration and repair. Design and
    manufacturabilty issues for Digital, analog, mixed signal, RF, MEMS,
    opto-electronic, biochemical-electronic, and nanotechnology based ICs.
    Redundency and other yield improving techniques. Design quality definitions
    and standards; design quality metrics to track and assess the quality of
    electronic circuit design, as well as the quality of the design process
    itself; design quality assurance techniques. Global, social, and economic
    implications of design quality. Design metrics, methodologies and flows for
    custom, semi-custom, ASIC, FPGA, RF, memory, networking circuit, etc. with
    emphasis on quality. Design metrics and quality standards for SoC, and SiP.

    Package - Design Interactions & Co-Design (PDI)
    Concurrent circuit and package design and effect on quality. Packaging
    electrical and thermal modeling and simulation for improved quality of
    product. SoC versus system in a package (SiP): design and technology
    solutions and tradeoffs; MCM and other packaging techniques; heat sink

    Design Verification and Design for Testability (DVFT)
    Hardware and Software, formal and simulation based design verification
    techniques to ensure the functional correctness of hardware early in the
    design cycle. DFT and BIST for digital and SoC. DFT for analog/mixed-signal
    ICs and systems-on-chip, DFT/BIST for memories. Test synthesis and
    synthesis for testability. DFT economics, DFT case studies. DFT and ATE.
    Fault diagnosis, IDDQ test, novel test methods, effectiveness of test
    methods, fault models and ATPG, and DPPM prediction. SoC/IP testing

    Robust Device, Interconnect, and Circuits (RDIC)
    Device, substrate, interconnect, circuit , and IP block modeling and
    simulation techniques; quality metrics, model order reduction; CMOS,
    Bipolar, and SiGe HBTs device modeling in the context of advanced digital,
    RF and high-speed circuits. Modeling and simulation of novel device and
    interconnect concepts. Signal integrity analysis: coupling, inductive and
    charge sharing noise; noise avoidance techniques. Power grid design,
    analysis and optimization; timing analysis and optimization; thermal
    analysis and design techniques for thermal management. Modeling statistical
    process variations to improve design margin and robustness, use of
    statistical circuit simulators. Power-conscious design methodologies and
    tools; low power devices, circuits and systems; power-aware computing and
    communication; system-level power optimization and management. Design
    techniques for leakage current management.

    EDA Methodologies, Tools, & IP Cores; Interoperability and Reuse(EDA)
    EDA tools addressing design quality. Management of design process, design
    flows and design databases. EDA tools interoperability issues and
    implications. Effect of emerging technologies, processes & devices on design
    flows, tools, and tool interoperability. Emerging EDA standards. EDA design
    methodologies and tools that address issues which impact the quality of the
    realization of designs into physical integrated circuits. IP modeling and
    abstraction. Design and maintenance of technology independent hard and soft
    IP blocks. Methods and tools for analysis, comparison and qualification of
    libraries and hard IP blocks. Challenges and solutions of the integration,
    testing, and qualifying of IP blocks from multiple vendors. Third party
    testing of IP blocks. Risk management of IP reuse. IP authoring tools and

    Physical Design, Methodologies & Tools (PDM)
    Physical synthesis flows for correct-by-construction quality silicon,
    implementation of large SoC designs. Tool frameworks and datamodels for
    tightly integrated incremental synthesis, placement, routing, timing
    analysis and verification. Placement, optimization, and routing techniques
    for noise sensitivity reduction and fixing. Algorithms and flows for
    harnessing crosstalk-delay during physical synthesis. Tool flows and
    techniques for antenna rule and electromigration rule avoidance and fixing.
    Spare-cell strategies for ECO, decoupling capacitance and antenna rule
    fixing. Planning tools for predictable high-current, low-voltage power
    distribution. Reliable clock tree generation and clock distribution
    methodologies for Gigahertz designs. EDA tools, design techniques, and
    methodologies, dealing with issues such as: timing closure, R, L, C
    extraction, ground/Vdd bounce, signal noise/cross-talk /substrate noise,
    voltage drop, power rail integrity, electromigration, hot carriers, EOS/ESD,
    plasma induced damage and other yield limiting effects, high frequency
    effects, thermal effects, power estimation, EMI/EMC, proximity correction &
    phase shift methods, verification (layout, circuit, function, etc.).

    Effects of Technology on IC Design, Performance, Reliability, and Yield
    Effect of emerging processes & devices on design's time to market, yield,
    reliability, and quality. Emerging issues in DSM CMOS: e.g. sub-threshold
    leakage, gate leakage, technology road mapping and technology extrapolation
    techniques. New and novel technologies such as SOI, Double-Gate(DG)-MOSFET,
    Gate-All-Around (GAA)-MOSFET, Vertical-MOSFET, strained CMOS, high-bandwidth
    metallization, etc. Challenges of mixed-signal design in digital CMOS or
    BiCMOS technology, including issues of substrate coupling, cross-talk and
    power supply noise. Significance of reliability effects such as gate oxide
    integrity, electromigration, ESD, etc., in relation to electronic design.
    Impacts of process technologies on circuit design and capabilities (e.g.
    low-Vt transistors versus increased off-state leakages) and the accuracy,
    use and implementation of SPICE models that faithfully reflect process
    technologies. Successful applications of TCAD to circuit design.

    System-level Design, Methodologies & Tools (SDM)
    Global, Social, and Economical Implications of Electronic System and Design
    Quality. Emerging standards and regulations influencing system quality.
    Emerging system-level design paradigms, methods and tools aiming at quality.
    System-level design process and flow management. System-level design
    modeling, analysis and synthesis, estimation and verification for correct
    high-quality hardware/software systems. Responsive, secure, and defect
    tolerant systems. New concepts, methods and tools addressing system-level
    design complexity and multitude of aspects. Methods and tools addressing the
    usage of technology information and manufacturing feedback in the system-,
    RTL- and logic level design. The influence of the nanometer technologies'
    (application-dependent) yield and other issues on the system-, RTL- and
    logic-level design. System-level trade-off analysis and multi-objective
    (yield, power, delay, area .) optimization. Effective and efficient design,
    implementation, analysis and validation of large SoCs integrating IP blocks
    from multiple vendors.

    Submission of Papers
    Paper submission must be done on-line via the conference web site at Authors should submit FULL-LENGTH, original, unpublished
    papers (Minimum 4, maximum 6 pages) along with an abstract of about 200
    words. Please check the as-printed appearance of your paper before
    uploading. To permit a blind review, do not include name(s) or
    affiliation(s) of the author(s) on the manuscript and abstract. The
    complete contact author information needs to be entered separately. When
    ready to submit your paper have the following information ready:

    I Title of the paper
    II Name, affiliation, complete mailing address and phone, fax, and email of
    the first author
    III Name, affiliations, city, state, country of additional authors
    IV Person to whom correspondence should be sent, if other than the 1st
    V Suggested area (as listed above)

    The guidelines for the final paper format are provided on the conference web
    site at Authors of the submitted papers must register and
    attend the conference for their paper to be published. Please note the
    following important dates:

    Paper Submission Deadline

    October 26, 2005

    Acceptance Notifications

    November 1, 2005

    Final Camera-Ready paper
    Janurary 3, 2006

    About ISQED
    The International Symposium on Quality Electronic Design (ISQED), is a
    premier Design & Design Automation conference, aimed at bridging the gap
    between and integration of, electronic design tools and processes,
    integrated circuit technologies, processes & manufacturing, to achieve
    design quality. ISQED is the pioneer and leading conference dealing with
    design for manufacturability and quality issues front-to-back. The
    conference provides a forum to present and exchange ideas and to promote the
    research, development, and application of design techniques & methods,
    design processes, and EDA design methodologies and tools that address issues
    which impact the quality of the realization of designs into physical
    integrated circuits. The conference attendees are primarily designers of the
    VLSI circuits & systems (IP & SoC), those involved in the research,
    development, and application of EDA/CAD Tools & design flows, process/device
    technologists, and semiconductor manufacturing specialists including
    equipment vendors. ISQED emphasizes a holistic approach toward design
    quality and intends to highlight and accelerate cooperation among the IC
    Design, EDA, Semiconductor Process Technology and Manufacturing communities.
    ISQED, Aug 29, 2005
    1. Advertisements

Ask a Question

Want to reply to this thread or ask your own question?

You'll need to choose a username for the site, which only take a couple of moments (here). After that, you can post your question and our members will help you out.