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FYI. - bhasker

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The International Engineering Consortium is pleased to announce its call for
papers for DesignCon 2004, the premier educational conference and technology
exhibition for semiconductor and electronic design engineers. To view a
list of suggested paper topics and submit an abstract for consideration,
visit the call for papers online at
http://www.designcon.com/conference/callforpapers.asp Abstract submissions
are due no later than August 29, 2003.

At DesignCon, engineers talk to engineers to find practical solutions to
their most vexing design and verification problems. Individuals presenting
papers at DesignCon will join an elite group offering unique case studies,
technology innovations, practical techniques, design tips, and application
overviews.

We solicit papers for two types of sessions: technical papers and TecForum
tutorials. Technical papers address design case studies and application
overviews, and are presented in fifty-minute sessions. TecForums are
half-day (three-hour) tutorial sessions, allowing the speakers to cover
their topics in greater depth and breadth. The technical sessions will be
held on Tuesday, February 3, and Wednesday, February 4; TecForum tutorials
are scheduled for Monday, February 2, and Thursday, February 5.

For more information, you may also contact Barry Sullivan at +1-312-559-3302
or via e-mail at