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SVTI 10-28-2007 06:24 PM

Final call for papers - ISQED08
 
FINAL CALL FOR PAPERS
ISQED 2008
International Symposium and Exhibits in Quality Electronic Design
Leading Design for Quality & Manufacturability
www.isqed.org


Paper Submission Deadline: October 29, 2007
Acceptance Notifications: November 23, 2007
Final Camera-Ready paper: January 3, 2008


The International Symposium on Quality Electronic Design (ISQED) is a
premier Design & Design Automation conference, aimed at bridging the gap
between and integration of, electronic design tools and processes,
integrated circuit technologies, processes & manufacturing, to achieve
design quality. ISQED is the pioneer and leading international conference
dealing with the design for manufacturability and quality issues
front-to-back. ISQED spans three days, Monday through Wednesday, in three
parallel tracks, hosting near 100 technical presentations, several keynote
speakers panel discussions, workshops /tutorials and other informal
meetings. Conference proceedings are published by IEEE and hosted in the
digital library. Proceedings CD ROMs are published by ACM. In addition,
continuing the tradition of reaching a wider readership in the IC design
community, ISQED will continue to publish special issues in leading
journals. The authors of high quality papers will be invited to submit an
extended version of their papers for the special journal issues.

Papers are requested in the following areas:

A pioneer and leading multidisciplinary conference, ISQED accepts and
promotes papers related to the manufacturing, VLSI design and EDA. Authors
are invited to submit papers in the various disciplines of high level
design, circuit design, test & verification, design automation tools;
processes; flows, device modeling, semiconductor technology, and advance
packaging.

1. Manufacturing, Semiconductor Process and Devices
1.1 Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ)
1.2 Effects of Technology on IC Design, Performance, Reliability,
and Yield (TRD)

2. Design
2.1 System-level Design, Methodologies & Tools (SDM)
2.2 Package - Design Interactions & Co-Design (PDI)
2.3 Robust & Power-conscious Devices, Interconnects, and Circuits
(PCC)
2.4 Emerging/Innovative Process & Device Technologies and Design
Issues (EDT)
2.5 Design of Reliable Circuits and Systems (DFR)
3. EDA/CAD
3.1 EDA Methodologies, Tools, Flows & IP Cores; Interoperability
and Reuse (EDA)
3.2 Design Verification and Design for Testability (DVFT)
3.3 Physical Design, Methodologies & Tools (PDM)

The details of various topics of paper submission is as follows:

Submission of Papers
Paper submission must be done on-line via the conference web site at
www.isqed.org. Authors should submit FULL-LENGTH, original, unpublished
papers (Minimum 4, maximum 6 pages) along with an abstract of about 200
words. Please check the as-printed appearance of your paper before
uploading. To permit a blind review, do not include name(s) or
affiliation(s) of the author(s) on the manuscript and abstract. The
complete contact author information needs to be entered separately.
The guidelines for the final paper format are provided on the conference web
site at www.isqed.org. Authors of the submitted papers must register and
attend the conference for their paper to be published.




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